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LC88F83B0A
No.A1228-13/25
Absolute Maximum Ratings at Ta = 25°C, VSS = LCDVSS0 = LCDVSS1 = 0V
Parameter
Symbol
Pin/Remarks
Conditions
Specification
VDD[V]
min
typ
max
unit
Maximum supply
voltage
VDD max
VDD
-0.3
+6.5
V
LCD supply
voltage
VLCD max
VLCD2 to VLCD4
VDD
-0.3
+6.5
LCD maximum
supply voltage
LCD max
SEG0 to SEG71
COM0 to COM15
VDD, VLCD4
-0.3
+6.5
Input voltage
VI(1)
RESB, XT1, CF1
-0.3
VDD+0.3
Input/output
voltage
VIO(1)
PORT 0, 1, 2
SEG71 to SEG56
-0.3
VDD+0.3
High
le
vel
o
u
tpu
tcurrent
Peak output
current
IOPH(1)
PORT0, 2
CMOS output selected
Current at each pin
-5
mA
IOPH(2)
PORT1
CMOS output selected
Current at each pin
-14
Mean output
current
(Note 1-1)
IOMH(1)
PORT0, 2
CMOS output selected
Current at each pin
-3
IOMH(2)
PORT1
CMOS output selected
Current at each pin
-9
Total output
current
ΣIOAH(1)
PORT0, 2
Total of all pins
22.5
ΣIOAH(2)
PORT1
Total of all pins
25
ΣIOAH(3)
PORT 0, 1, 2
Total of all pins
47.5
Low
level
ou
tpu
t
cu
rrent
Peak output
current
IOPL(1)
PORT0, 2
Current at each pin
13
IOPL(2)
PORT1
Current at each pin
17
Mean output
current
(Note 1-1)
IOML(1)
PORT0, 2
Current at each pin
7.5
IOML(2)
PORT1
Current at each pin
10.5
Total output
current
ΣIOAL(1)
PORT0, 2
Total of all pins
35
ΣIOAL(2)
PORT1
Total of all pins
60
ΣIOAL(3)
PORT 0, 1, 2
Total of all pins
80
Allowable power
dissipation
Pd max
TQFP120(14×14)
Ta=-20 to +75
°C
250
mW
Operating ambient
temperature
Topg
-20
75
°C
Storage ambient
temperature
Tstg
-65
125
Note 1-1: The mean output current is a mean value measured over 100ms.
Note: We assume that the measurements for the allowable operating ranges and electrical characteristics described in
this document are performed with the chip mounted in a package.
Although this product is shipped in chip form, the characteristic values listed in this document are measured with
this IC mounted on a Our designated package at operating ambient temperature range of -20°C to +70°C.
The specifications of this product in package form or in chip forms are basically identical, however, the
characteristics of the product in chip form may vary depending on the board on which the product is mounted, the
bonding pressure, and the type of mold resin used.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
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